GIGABYTE MS33-AR0 Motherboard-CPU Max Series Processors–E-ATX DP–350W

The GIGABYTE MS33-AR0 is a dual-socket E-ATX server motherboard built for the Intel Xeon Max Series Processors, delivering extreme compute density, high memory bandwidth, and advanced expandability. Designed for HPC clusters, AI/ML workloads, enterprise computing, and cloud infrastructure, it supports DDR5 memory, PCIe Gen5 lanes, and integrated remote management. With a 350W CPU TDP envelope per socket, it balances high-performance scalability with energy efficiency, making it an excellent platform for mission-critical workloads.

Key Features

• Processor Support
  • Dual-socket configuration for Intel Xeon Max Series Processors (LGA4677 platform).
  • Select SKUs feature integrated HBM2e memory for extreme bandwidth and HPC optimization.
  • Designed for scientific computing, AI acceleration, and parallel workloads.
• Form Factor
  • E-ATX (305 x 330mm), dual-processor layout.
  • Rackmount-optimized for enterprise servers and HPC nodes.
• Memory
  • Supports DDR5 RDIMM/LRDIMM with higher bandwidth and lower latency.
  • Up to 4TB+ scalable memory capacity depending on configuration.
  • ECC-enabled for mission-critical error correction and stability.
• Expansion Capability
  • Multiple PCIe Gen5 slots for GPUs, accelerators, and storage controllers.
  • Ideal for multi-GPU AI training, big data, and HPC acceleration workloads.
• Storage Options
  • SATA 6Gb/s ports for HDD/SSD storage.
  • M.2 NVMe Gen4/Gen5 slots for ultra-fast enterprise SSDs.
  • RAID support for redundancy and enterprise-class data protection.
• Networking
  • Integrated dual LAN ports (1GbE/10GbE options).
  • Expandable up to 100/200GbE via PCIe NICs for hyperscale networking.
• Power & Efficiency
  • Optimized for 350W CPU TDP per socket, providing excellent performance-per-watt.
  • Thermal and power design ensures 24/7 continuous heavy-duty workloads.
• System Management
  • Equipped with AST2600 BMC with IPMI 2.0 & Redfish API.
  • Enables full remote system health monitoring (CPU, memory, power, fans, thermals).

Applications

• High-Performance Computing (HPC) – For simulations, modeling, and advanced research clusters.
• Artificial Intelligence & Machine Learning – Multi-GPU AI training and inference workloads.
• Cloud & Virtualization – Scalable dual-socket design for SaaS, PaaS, and IaaS platforms.
• Enterprise Databases & Storage – Supports data-heavy environments with high memory and I/O bandwidth.
• Defense, Research & Supercomputing – Suitable for mission-critical environments requiring reliability and scalability.