GIGABYTE MS73-HB0 Motherboard-Dual Processors–E-ATX DP–270W

The GIGABYTE MS73-HB0 is a dual-socket E-ATX server motherboard built for enterprise IT, virtualization, storage, and cloud environments. Supporting dual high-performance processors within a 270W CPU TDP envelope per socket, it provides excellent efficiency while delivering enterprise-grade scalability. With support for ECC DDR4/DDR5 memory (depending on CPU), PCIe Gen4/Gen5 expansion, and robust remote management, the MS73-HB0 is optimized for data center workloads, telecom networks, and edge computing applications.

Key Features

• Processor Support
  • Dual-socket support for enterprise-class processors (Intel Xeon or AMD EPYC families, depending on SKU).
  • Designed to deliver strong multi-core parallelism and efficiency.
  • Optimized for 270W CPU TDP per socket, balancing performance and power savings.
• Form Factor
  • E-ATX (305 x 330mm) dual-processor design.
  • Rackmount-ready for enterprise and hyperscale data center integration.
• Memory
  • Supports ECC DDR4/DDR5 RDIMM/LRDIMM, depending on CPU generation.
  • Large memory capacity scaling for virtualization and in-memory databases.
  • ECC-enabled for mission-critical reliability and data integrity.
• Expansion Capability
  • Multiple PCIe Gen4/Gen5 slots for GPUs, DPUs, FPGAs, or high-performance NICs.
  • Flexible platform for AI acceleration, networking, and storage expansion.
• Storage Options
  • SATA 6Gb/s ports for enterprise HDD/SSD configurations.
  • M.2 NVMe Gen4/Gen5 slots for ultra-fast SSD storage.
  • RAID support for redundancy and data protection.
• Networking
  • Integrated dual LAN controllers (1GbE/10GbE based on SKU).
  • Expandable up to 25/40/100GbE through PCIe NICs for hyperscale environments.
• Power & Efficiency
  • Optimized for 270W TDP per socket, delivering high efficiency and reliability.
  • Advanced thermal and power design for continuous 24/7 operation.
• Remote Management
  • Onboard AST2600 BMC with IPMI 2.0 & Redfish API support.
  • Remote health monitoring for CPU, memory, storage, thermals, and power subsystems.

Applications

• Cloud Computing & Virtualization – Designed for SaaS, PaaS, and IaaS workloads.
• Enterprise IT & Edge Data Centers – Efficient dual-socket platform for distributed deployments.
• AI Inference & Data Analytics – Expandable with accelerators for analytics and lightweight AI tasks.
• Storage & Database Systems – RAID-ready with strong memory and storage integration.
• Telecom & Networking – Ideal for NFV, SDN, and 5G infrastructure environments.