GIGABYTE MZ73-LM2 Motherboard-9005/9004 Series Processors–E-ATX DP–500W

The GIGABYTE MZ73-LM2 is a dual-socket E-ATX server motherboard engineered for the latest AMD EPYC™ 9005 (Turin) and 9004 (Genoa/Bergamo) Series Processors. Designed for maximum scalability, efficiency, and reliability, it delivers industry-leading compute density with support for DDR5 memory, PCIe Gen5 expansion, and high-speed networking. With its 500W CPU TDP envelope, the MZ73-LM2 is built for HPC, AI/ML, cloud-native data centers, and enterprise-scale virtualization.

Key Features

• Processor Support
  • Dual-socket AMD EPYC™ 9005 / 9004 Series (SP5)
  • Supports up to 192 cores / 384 threads in a 2P configuration.
  • Optimized for performance-per-watt efficiency across compute-intensive workloads.
• Form Factor
  • E-ATX (305 x 330mm) – dual-processor layout with optimized airflow and thermal design.
  • Rackmount-ready for enterprise and hyperscale deployments.
• Memory
  • 12-channel DDR5 architecture per CPU for maximum bandwidth.
  • Supports ECC DDR5 RDIMM/LRDIMM with large capacity scaling (4TB+).
  • ECC-enabled for mission-critical data integrity.
• Expansion Capability
  • Multiple PCIe Gen5 slots for GPUs, FPGAs, DPUs, and high-speed storage/networking adapters.
  • Ready for multi-GPU AI/ML training, HPC simulation, and virtualization acceleration.
• Storage Options
  • Multiple SATA 6Gb/s ports for HDD/SSD integration.
  • 2 NVMe Gen4/Gen5 slots for high-speed SSD storage.
  • Enterprise-class RAID support for redundancy and data protection.
• Networking
  • Integrated dual LAN controllers (1GbE/10GbE, depending on SKU).
  • Expansion capability up to 100/200GbE with PCIe NICs for hyperscale connectivity.
• Power & Efficiency
  • Optimized for 500W CPU TDP envelope, supporting higher-core SKUs with sustained performance.
  • Energy-efficient design lowers TCO in large-scale deployments.
• Management & Monitoring
  • Equipped with AST2600 BMC, supporting IPMI 2.0 & Redfish API.
  • Enables full remote server monitoring and control, including CPU, memory, storage, power, and thermal health.

Applications

• High-Performance Computing (HPC) – Advanced simulations, modeling, and research requiring extreme compute density.
• Artificial Intelligence & Machine Learning – Multi-GPU AI training and inference workloads.
• Cloud Computing & Virtualization – Scalable dual-processor platform for cloud-native SaaS, PaaS, and IaaS.
• Enterprise Databases & Storage – Built for large-scale databases, in-memory processing, and storage nodes.
• Telecommunications & Edge Data Centers – Optimized for 5G, NFV, and real-time edge applications.